Thank you, I think if you read this thread you would understand why the case is "big" with big heatsinks. I want to run it at lowest temperature under any possible conditions like long-term full power. I do not want the module to be limited at 1/5 maximum power in a longer run. The module itself has idle power consumption of 15.5W (you may check in the datasheet, 8.5W SMPS, and 3.5W per amp channel). If I use the heatsink with thermal resistance of 0.4°C/W, the temperature increase at idle is +6.2°C. If you use a conventional implementation with the module mounted on sheet metal, the thermal resistance can be estimated from (and is likely several °C/W).
The free flat plate heat sink calculator is a tool for calculating the perfomance a heat sink formed from a flat sheet of metal cool via natural convection and radiation
www.heatsinkcalculator.com
and the temperature will be increased much much more. The second reason is that the the 19" wide case fits to my audio components. A small box does not. I have no need to use small boxes and to reduce life span and product reliability. However I know - who cares

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So this is my design philosophy, I do not care about miniaturization at expense of reliability.