I am sorry - but the heat sinks raised like that draw NO heat from the PCB. Without thermal contact, the only way heat can be drawn away is convection directly from the power devices, then with the heat sinks in the way from air to the flat surface of the underside of the heat sink - then to be given back to air on the top side.
That is total nonsense: Heat transfer from air to metal is very inefficient which is why fins are used to increase surface area. Far more effective for convection to be allowed to continue without the barrier of the heat sink. Even as it is, disrupted convection around the heat sink will carry more heat away than conduction from air to heat sink to air.
I also don't believe the heat sinks were anything other than a visual con. As they've said, the fets don't need them. This would have been clear during development even if they were thermally connected.
Premium are obfuscating, and the glue between the chokes and the heat sink tell a different story.
I don't have any issue from a product quality point of view with the glue as long as they have good manufacturing controls for its application. But then all they need is a mechanical bracket to support the chokes which could be made of plastic to eliminate any magnetic interaction, and insulation risks. Further, a plastic bracket could incorporate clips around the chokes enabling them to eliminate the glueing process.
I do have an issue with the apparent dishonesty of putting a heat sink shaped object in the product for no reason other than - what?