The overall design of the case looks good. The front button and rear connectors look good and are well placed.
The heat dissipation still seems problematic:
- When these TPA325x chips get hot, they start to degrade in performance, output power, and lifetime. A big part of the success of the 3e audio 260-2-29A PFFB module design was the huge aluminum heat sink under the board.
- Using the amplifier box to achieve the same effect can work, but care must be taken to provide a reliable interface between the chips and the box.
- A strip of U-bent aluminum between the chips and the box and a few dabs of thermal grease won't do the trick.
I'd like to see a preliminary reading with an infrared thermometer pointed at the TPA325x chips and the top and bottom plates of this case. If the case does not get hot, it is not a good heatsink.