Hello ASR,
Hope everyone is enjoying this wonderful week of weather (depending on your location, I suppose).
I'm looking at a couple different case designs for an upcoming DIY project, and will likely be using it as direct reference for an upcoming launch offering fully assembled Hypex and Purifi amplifiers out of Canada. This is somewhat for personal preference, but also to gather data about potential design language of the company moving forward. I'm excited to share more details as they become available, and truly appreciate any feedback and suggestions.
The poll is to decide between an external heatsink type of case, or one that's smoother and (potentially) more pleasing to the eye. I will likely launch with all-black offers and may introduce silver down the line as well. The external heatsink case would have the modules directly connected to the heatinks. The smooth one use a different layout, but still use heatsinks mounted to the modules and to the case.
Note: these may not be the exact final cases I end up going with, but the general design approach will be very similar for either one.
#1 - External Heatsink Case
#2 - Smooth Anodized Case
While I'm not opposed to considering different case designs for different approaches, the launch design will likely lead the language for a while until that happens.
Hope everyone is enjoying this wonderful week of weather (depending on your location, I suppose).
I'm looking at a couple different case designs for an upcoming DIY project, and will likely be using it as direct reference for an upcoming launch offering fully assembled Hypex and Purifi amplifiers out of Canada. This is somewhat for personal preference, but also to gather data about potential design language of the company moving forward. I'm excited to share more details as they become available, and truly appreciate any feedback and suggestions.
The poll is to decide between an external heatsink type of case, or one that's smoother and (potentially) more pleasing to the eye. I will likely launch with all-black offers and may introduce silver down the line as well. The external heatsink case would have the modules directly connected to the heatinks. The smooth one use a different layout, but still use heatsinks mounted to the modules and to the case.
Note: these may not be the exact final cases I end up going with, but the general design approach will be very similar for either one.
#1 - External Heatsink Case
#2 - Smooth Anodized Case
While I'm not opposed to considering different case designs for different approaches, the launch design will likely lead the language for a while until that happens.
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