I found a new clue explaining the hump. This information is from TI and related to newest mobile DAC chip. I tried to expain it as simple as possible, but it is still a long story.
Majority of modern audio DAC chip has multi-bit delta-sigma architecture to achieve lower out-of-band noise and robustness to jitter. But 'multi-bit' means that there is an issue about element mismatch just as R2R DACs. So several manufacturers like ESS uses DEM(Dynamic Element Matching) to send the distortion by element mismatch to ultrasonic frequency.
DEM is implemented by using a splitter between modulator and dac. The spltter distributes the signal to each 1bit dac(a switch) in a certain pattern. This pattern can be random, DWA(Data Weighted Algorithm) or modified DWA. The most common method and what ESS use is barrel-shifting DWA. This
link will describe it with pictures.
However, barrel-shifting DWA has problem with 'tone' that is created by itself. The following presentation is a part of
A 110dB SNR and 0.5mW Current Steering Audio DAC in 45nm CMOS from TI
In this presentation, the root cause of THD hump is said to be a tone behaviour of DWA. This is the most powerful scientific explanation of 'hump' I know. Even though ESS notched the tone out as shown on the presentation above, it basically don't fix the drawback of DWA and it can still cause problems. A white paper from Wolfson(
link) supports this theory. This paper criticizes simple barrel-shifting DEM that 'since the error is only shaped by a first order function, there are similar concerns as for first order delta-sigma modulators - in particular the presence of in-band tones for small DC offsets.' 'A small dc offset causes the element selection pattern to slowly rotate and with a component mismatch a low frequency tone can occur in standard rotating DEM scheme.'
But this can't explain the exceptional cases like Benchmark DAC3, Melokin DA9.1 and Topping NX4. Furthermore, the previous resource from ESS that I used to explain THD hump(
link) boasts the improvement of their SabrePRO that they added dither on quantizer and improved DEM algorithm. However, as many DACs with SabrePRO chip still suffer from the hump, PRO versions may not have solved the issue.
In my personal opinion, ESS DAC is more sensitive to DC offset than other DAC chips because of DEM issue. But just as John Siau said, if the output circuit is carefully designed with well-trimmed differential amplifier and cancel out the distortion precisely, the hump can be abbreviated. This is practical theory that can explain most of the measurements. But I don't know exactly why is it sensitive to DC offset and why it can be fixed.
To conclude, nothing is clear and we need more measurements and data unless ESS gives us information.