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Mark Levinson Fake Copies

Doodski

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I don’t think PCs need to move a kilowatt of heat, and less expensive alternatives would make more sense. Vapor phase cooling is used with LDMOS devices today in RF amplifiers. These are compact chips (1 square inch) that put out a kilowatt of heat that must be effectively removed so as to not fry the device.
Are they cooling to something like -100C or colder?
 

JWAmerica

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I don’t think PCs need to move a kilowatt of heat, and less expensive alternatives would make more sense. Vapor phase cooling is used with LDMOS devices today in RF amplifiers. These are compact chips (1 square inch) that put out a kilowatt of heat that must be effectively removed so as to not fry the device.
Overclocking can ramp heat production very quickly. Cpu die size is 0.25-0.33 sq in and can pull a couple of hundred watts easily. Liquid nitrogen cooling is used for world record attempts.
 
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