But let's get back to the OP's question shall we? I have an 18 month old Hypex NC-252MP sitting here on my bench. Dead. Built 41st week of 2019. Sent to me by an ASR member to investigate why it failed as it had a very easy life in a multichannel amplifier. The brand and the member will stay anonymous as he was very happy with their customer service in rapidly rectifying the situation to his satisfaction.
Let's have a quick visual inspection to see if anything stands out.
View attachment 147422
I can immediately see some
very dodgy hand soldering on the SMPS primary side switching transistors and some of the output MOSFETS, because these are the parts done by
humans. Regardless, it should have never left the factory with soldering this poor. I think I am onto something:
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Also, the board is clearly under a lot of strain (it bends) due to the screwing down of the PCB to the heat-spreader near the heat producing SMPS switchers:
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The board bends enough to be 0.76mm out of alignment and the devices are no longer firmly pressed against the heat spreader:
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The screws are also too far away from the devices and the impregnated heat transfer pad is too thick. (approx device package positions marked in red). They should not be using distantly mounted screw points and relying on the flexible PCB to maintain adequate device to heatsink contact. This is bad design 101.
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First of all, let's dismantle the sucker and remove the heat-spreading aluminium plate and have a look-see:
View attachment 147427
Yes, you guessed it! It's gone fully Chernobyl!
Vaporised SMD components hanging off the primary side SMPS switching transistors. Basically, The board flexes under pressure (from the squishy "thermal" pad), so the transistors (FETs) are not adequately thermally coupled any longer to the aluminium spreader. They eventually fail from over heating (these particular devices are both are shorted) and they take out some associated components around them:
View attachment 147428
View attachment 147429
A real mess. There's even a poor SMD transistor with its package cover blown right off. You can see the junction components! And a nice vaporized resistor or two, along with those poor MOSFETs that gave up due to their inability to get rid of heat.
All due to inadequately or properly mounting (you know, with screws, nuts and washers) and heatsinking the transistors. Hypex are simply squashing the devices against the aluminium plate, using plenty of PCBs screws and a foam heat pad, but not considering PCB material deforms under heat and pressure over a (short) period of time.
In my opinion, all the NC-252MPs will likely suffer the same fate in years to come, if this key section is not revised. Not remotely good engineering at all and certainly not likely to last the length of time customers deserve.
Apart from this glaring design fault, the rest of the board is of good quality. The components are adequate and very nicely laid out. I do not like TO220 heat producing devices squashed under pressure from PCBs. It doesn't work. It creates more problems than it saves money. And all the secondary rectifiers and output stage FETs are the same unfortunately.
Hypex can do a whole lot better if they are selling state of the art. 18 months for an entire 250WPC module including PSU is just not remotely good enough.