From the precedent thread, I understood that the TPA3255 has a design flaw when programed as BTL or PBTL. The sound becomes normal when used as 4xSE.
With 4xSE, channels A and C have same the phase also B and D. This feature permits to use the BD modulation.
I also remarked that this chip has variable dead time, similar to STmicro's STA516, adapting according to the intensity of the current. This feature makes the chip best suitable for BD modulation, eliminating the distortion due to dead time, except at very low power in10-20mw range that can be neglected.
The amp will run at 600khz carrier frequency, but in BD mod, the frequency doubles and the residual will become 1.2Mhz. This means lower resonant Q, higher frequency response, and more post filter feedback.
I will design using LCSC electronic parts to be manufactured by JLCPCB as much as possible.
To avoid noise from 12v step down converter, it will be an external ready made module.
Below is the starting schematic, I need to decide whether the chip should be cooled by a Fan+heatsink or by the casing with the chip on the bottom side.
I will modify my actual board to test. It will use 4.7uH inductors or Sagami type 2x10uH paralleled.
With 4xSE, channels A and C have same the phase also B and D. This feature permits to use the BD modulation.
I also remarked that this chip has variable dead time, similar to STmicro's STA516, adapting according to the intensity of the current. This feature makes the chip best suitable for BD modulation, eliminating the distortion due to dead time, except at very low power in10-20mw range that can be neglected.
The amp will run at 600khz carrier frequency, but in BD mod, the frequency doubles and the residual will become 1.2Mhz. This means lower resonant Q, higher frequency response, and more post filter feedback.
I will design using LCSC electronic parts to be manufactured by JLCPCB as much as possible.
To avoid noise from 12v step down converter, it will be an external ready made module.
Below is the starting schematic, I need to decide whether the chip should be cooled by a Fan+heatsink or by the casing with the chip on the bottom side.
I will modify my actual board to test. It will use 4.7uH inductors or Sagami type 2x10uH paralleled.