@Lräk
Good to hear!
Heat is no problem. not only the chips run cooler but since there is no resin around, nothing will break solderjoins anymore. it should last basically forever.
if you heat the old module the resin becomes brittle, but only while its hot. once it cools, it becomes hard again. putting it in a air fryer wont work.
you need to break away chunck by chunk while heating it with hot air, it needs to be over 250..300°C. its tideuos and you get burnt, a lot
didnt had luck with heating and putting IPA on it. also tried WD40 to creep in there and loosen it from the board.. didnt work either.
once the bottom resin layer is gone, you might be able to pry the board out of the housing, but it might bend or rip off components in the process.
I got a few more modules in stock.
recently made a new batch since a bunch of people wanted one and i ran out of my first batchand prototypes pretty quickly.
worldwide shipping. if you dont know how to desolder or missing the required tools i can offer to replace it.
but only within EU because dealing with customs back and forth is a pain.