Once again, you are mistaken on several points.
The fact is that the cooling performance of the PA5/Mini 300 is marginally better than that of the A5—more on that later.
The block inside the A5/A7 does not act as a heatsink itself; instead, it serves solely to transfer heat to the chassis, meaning the chassis acts as the sole heatsink.
The following information should also be of interest to
@whazzup and other owners of Mini 300/PA5 and A5/A7 amplifiers who believe they need to modify the cooling system.
Since we are currently developing products for the audio sector, I have hundreds of hours of measurement data regarding the temperature behavior of the PA5/Mini 300 and the 3E Audio A5 in relation to ambient temperature.
What stands out is that, across the entire ambient temperature range, the PA5 maintains a chassis temperature 0.5°C lower than the A5. At an ambient temperature of 30°C, the readings are 41.4°C for the PA5/Mini 300 and 41.9°C for the A5.
Within an ambient temperature range of 20°C to 35°C, the maximum difference is 0.7°C in favor of the PA5/Mini 300.
The internal temperatures of the individual components in the A5 are similar to those measured by
@whazzup. Despite the A5 having larger overall cooling vents, this occurs because the circuit board is mounted upside down; consequently, the heat cannot simply rise upwards but instead accumulates before eventually escaping through the vents.
Perhaps you should consider why two different manufacturers—both producing TPA3251 amplifiers with the best measurement results currently available—arrive at such similar cooling outcomes and temperature profiles despite using different design concepts. Once again, for both devices, it would definitely have been cheaper to manufacture them with a finned heatsink designed for strong convection.
However, these heatsinks only cool the amplifier chip—which easily withstands temperatures of 120°C and is, alongside the op-amps, the most durable component.
Consequently, the cooling design in these two devices cannot possibly be a matter of budget or cost; for the PA5/Mini 300, it certainly wouldn't have been more expensive, and for the A5, it would definitely have been cheaper—including assembly costs.
"The block inside the A5/A7 does not act as a heatsink itself; instead, it serves solely to transfer heat to the chassis, meaning the chassis acts as the sole heatsink."
The very fact that the block makes contact with the chip and transfers heat to the chassis makes it an integral part of the heatsink, yes the block itself radiates minimal heat compared to the chassis which does the majority of the dissipation, but it is part of the heatsink. Saying otherwise is just not factually correct. Your argument here is like saying that the thermal pipes in a pc/server heatsink are not part of the heatsink, as they are not the part dissipating the heat, merely moving it away from the chip to the fins/radiator.
"What stands out is that, across the entire ambient temperature range, the PA5 maintains a chassis temperature 0.5°C lower than the A5"
It makes sense that the a5 chassis temperature is higher than the pa5/mini 300 precisely because the chassis is directly being used as part of the heatsink to dissipate the heat, the heat from the amp chip is transfered directly to it. It also has the pcb at the top internally, radiating heat directly to it as well, which i would imagine impacts measurements taken on the top of the chassis.
The pa5/mini 300 chassis and heatsink are separated by an airgap and it is purely heating up due to the heat buildup within the air in the case.
"At an ambient temperature of 30°C, the readings are 41.4°C for the PA5/Mini 300 and 41.9°C for the A5"
Looking at it another way, the heatsink for the A5 is at 41.9c at an ambient temperature of 30c, meanwhile, whazzups measurements show that at 30c ambient the mini 300's heatsink is at 50c while open to uncontrolled convection outside its chassis which is a best-case measurement for its design and it will be higher when it is contained in the chassis with the restricted airflow. What you are saying is that the a5 design is a better heatsink design.
"The internal temperatures of the individual components in the A5 are similar to those measured by
@whazzup. Despite the A5 having larger overall cooling vents, this occurs because the circuit board is mounted upside down; consequently, the heat cannot simply rise upwards but instead accumulates before eventually escaping through the vents."
Whazzup measured them in open air, so are you saying the A5 design has enough ventilation to match that then? That sounds good to me, maybe the mini300 could match those temps with the case on if it had similar levels of ventilation.
"Consequently, the cooling design in these two devices cannot possibly be a matter of budget or cost; for the PA5/Mini 300, it certainly wouldn't have been more expensive, and for the A5, it would definitely have been cheaper—including assembly costs."
So are you saying then that the pa5 which came out first, having vents on the bottom that are mostly blocked, was an intentional design decision and not likely an oversight or the result of a revised design that was kept due to cost of changing it? What functional reason is there for cutting ventilation holes and then blocking them?
Then the pa7 came out, it flips the pcb upside down, increases ventilation significantly and changes the heatsink design completely? Are you saying that wasn't done because the PA5's heatsink design perhaps wasn't adequate and could be improved upon? If the pa5 design is so optimal and well designed then why didn't they just put a bigger finned heatsink inside the bigger chassis, why did they go with a completely different design?
The mini 300 then comes out, using the same chassis as the pa5 as far as I can tell, and just uses the same heatsink design as well, to save cost on manufacturing or sourcing new parts.
You are being very pedantic and trying to strawman arguments while ignoring valid points. Again, let me reiterate, I have never said that it is not a functional design, only that it could be better and is likely a result of meeting a performance/cost balance and other design constraints.
End of the day, I've drilled speed holes in mine directly above the heatsink, I can feel the hot air gently moving through them, and the chassis itself is noticeably cooler to the touch. Will this increase its life expectancy? Maybe, maybe not. But it certainly won't make it worse.