I'm happy to report that I have managed to repair my PA5.
Thanks to
@gamerpaddy 's
post on the PA5's review thread, I decided to attempt to repair mine as well.
Desoldering the module was hard, even with a hot air soldering station. I wouldn't even attempt without one.
De-potting the module was also tedious, the hot air soldering station helped a lot.
I did destroy a 10K Ohm resistor while de-potting. I had to scavenge in a box containing project parts from my college days and found 0402 10K resistors, which are much smaller than the 0603 and 0805 parts used by Topping. See if you can find it in the pictures.
0402 smd parts are 1mm x 0.5mm, they are hard to solder with the naked eye, it's much easier with a microscope, which I do not have.
With a copious amount of solder flux, I melted all solder joints with my soldering iron and soldered 100 mil headers on the main board to insert the module without soldering it to the main board.
I might eventually remove the headers and solder the module directly.
What I believe repaired the unit is melting the solder joints, which is inline with
@gamerpaddy 's
conclusion here.
It also confirm that the ICs, which are the heat sources, are themselves fine, as said by
JohnYang from Topping here.
Thus, I also believe that the likely cause is uneven thermal expansion between the PCB and potting compound causing cracks in solder joints.
I have ordered a
50x25x10mm heatsink to install on the module of my second PA5 that has had no issue yet.