I would like to see if they still used the technique of putting the MOSFETs under the PCB by pressing on it to compress the thick and cheap silicone thermal pads, with the screws far enough away to flex everything.
The new amplifier module has that strange plate underneath with raised edges ... I don't understand exactly what it is or what function it has.
Honestly, the way they manage heat dissipation in general doesn't seem very serious to me... rather haphazard.
Instead of using silicone pads (which degrade due to oil bleeding) in a rather high thickness (2mm does not transmit heat very well) they could use the alumina pads and screw the MOSFETs through the hole on a nice plate, as they do in some cases with power supplies and old modules.
My actual nCores arrived extremely warped because of this.
I wanted to replace the thermal pads with better ones, so I asked the Hypex what thermal conductivity those they used had. They kindly sent me the datasheet, where I figured it was 6W / mK.
So I bought more performing ones, with inevitably greater hardness but with a slightly lower thickness, and I installed them by tightening the screws just enough so as not to see that ugly deformation and avoid oil bleeding (the original ones were bad from this point of view).
For the moment it seems like an effective solution because I have reduced the pressure on the PCB and dissipation increased at the same time (they run cooler then before).
I hope they last a long time this way and don't end up like the failed one that restorer-john analyzed and posted here on ASR.