denengineer
New Member
Hey folks, newcomer here after being a reader for a few years
I’m working on small DIY DAP (imagine if iPod Shuffle and Shanling M0 had a baby) and after 1st prototype I’m trying to squeeze the best possible performance from the limited PCB space / orientation and will appreciate your help
I did split design into multiple PCBs and arranged them into C-shape - you could see high freq. and audio parts + dimensions marked on the images attached:


I don’t have any experience designing top-notch audio PCBs (or low noise analog in general), so all extra opinions/thoughts are very welcome, but my main questions are:

In overall I want to create a portable DAP that could get golfing panther
So any drops of wisdom from you folks will really help to make it happen!
I’m working on small DIY DAP (imagine if iPod Shuffle and Shanling M0 had a baby) and after 1st prototype I’m trying to squeeze the best possible performance from the limited PCB space / orientation and will appreciate your help
I did split design into multiple PCBs and arranged them into C-shape - you could see high freq. and audio parts + dimensions marked on the images attached:


I don’t have any experience designing top-notch audio PCBs (or low noise analog in general), so all extra opinions/thoughts are very welcome, but my main questions are:
- I’ve used PCM5102A to just have I2S sound output - but does it make sense to use smth better? I’ve heard that biggest contributor to noise will be the rest of the design and getting better DAC with lower noise floor is not really worth it since the rest of the design won’t be able to go that low.
- What is the best amplification option to squeeze in here considering it will be for headphones only? I don’t drive anything demanding, but having some margin for the future will be useful.
- Any recommendation on analog parts (i.e. using smth else than mlcc caps, any specific manufacturer e.t.c.)? Any examples of best in class PCBs of similar size to learn from?
- If I will route audio signal from amp to jack on another PCB via headers - could that introduce significant extra noise?
- Is common PCB stackup S-G-G-S is okay or I could get extra shielding by using G-S-S-G? Considering that on DAC PCB below analog signal it will be mostly G-G-S-G since I doubt I would need 2 layers for analog part and will just pour 2nd signal as well.
- Will making PCB 0.8mm introduce some extra coupling that will be critical compared to 1.2mm stackup?
- Should I put some shielding on PCB with MCU? Like the ones that could be usually seen on ESP32 modules or on XIAO boards - thin metal enclosure wrapping top layer components to limit noise coupling to DAC PCB. Or it’s just way too far to influence another PCB?
- I plan to use connected ground planes - i.e. no separation between analog and digital. Or it’s a good idea to split them and then connect using ferrite beads and other voodoo magic?
- LDOs are the best choice for portable analog power source, right? Since buck & switching will introduce more noise.
- Using same LDO for DAC and MCU DVDD is okay, right? Only AVDD should have separate LDO to decouple from digital noise.
- Should I do vias stitching if I don't have any wireless onboard? Could that help shield any external noise or it's not an issue unless I add bluetooth.
- I have another option of stackup where PCBs will be on top of each other (”Parallel Stackup” image) - will that couple way too much noise from digital PCB?

In overall I want to create a portable DAP that could get golfing panther

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