I'm another non-expert who'd like to know the source of, and theory behind, the 4mm aluminium claim, as it contradicts my understanding from what I've read on electrostatic, magnetic and RF shielding so far. I've not found any references that thickness beyond a foil is needed for RF or electrostatic shielding. A good conductor with gaps small relative to the wavelentgh to be blocked is apparently a requirement, but not thickness. For magnetic shielding you seem to need a ferromagnetic material (so not aluminium) that's thick enough not to saturate given the field strength you're trying to block. As with all things there may be an issue of what 'good enough' is, or deviations of real materials and structures from 'ideal' at different frequencies, so I'd love to see any references for what makes a particular thickness of steel or aluminium necessary, or what attenuation they provide at what frequency.
If the board is well designed then susceptibility to, and emissions of, electromagnetic interference may be low enough that no screening case is required. The Atom turns in an exemplary performance despite having an unshielded plastic case for example, and a surprising amount of modern test equipment has only a local screening can on particularly sensitive parts of the instrument. Screening cans are usually thin (<1mm, often 0.2-0.3mm) and ferromagnetic according to the datasheets I've seen at suppliers like DigiKey and RS.
EEVBlog #1176 gives a reasonably accessible introduction to EMC and radiated emissions, and how board layout affects it. Others at the same site cover making a DIY probe, and comparing it to commercial ones, although the scopes used are still somewhat expensive. The
even cheaper option is to use RTL-SDR instead of the scope. Bruno talks about design for low emissions from class D in his AES presentation '
The Bits In Between' starting on page 124, and susceptibility in the PCB Layout section of '
The G Word' so it's fair to expect they've been been taken into consideration here, at least at the board level. The presentation also shows that this isn't always true! The NC400 docs make suggestions about how to do the input, power and output wiring to reduce interference there, and that's still inside the case. In that sense the photos can show where a manufacturer has done something good or bad with the layout in the case.