Hi.
It is true that this video is rather hard to digest and should have been summarized, so excuse me
I highlighted it simply to emphasize the importance of the supply voltage used with TPA3255-based chips, as they generate a great deal of heat—
even at idle.
I will also focus on the importance of the enclosure's volume and material (including thickness), as well as the care taken in selecting the heat dissipation method.
We worked extensively on this aspect with Alexander Lin (O-NOORUS) for the D3 Pro model; here is the principle that was used ->
You will note that the heatsink covers almost the entire surface of the PCB; while it would have been preferable for it to be in full contact with the amplifier casing—which itself could benefit from being slightly larger and made of thicker material—cost constraints are tight in order to keep the product within a price range acceptable to consumers.
I do not claim that this is the ultimate solution or approach, but rather one that should be explored for future refinement—aiming for even greater efficiency—by the various manufacturers of Class D amplifiers using Texas Instruments power chips (in this case, the TPA3255).
Furthermore, based on my extensive testing, I maintain that a 42V power supply voltage offers the best compromise between heat dissipation at idle and available power for driving speakers, whether 4-ohm or 8-ohm models.
I think it would be interesting to hear FOSI's perspective on this, as well as that of other manufacturers and technicians with solid DIY experience regarding this type of amplifier.
Of course, I am not overlooking—since it is the
most important factor—user feedback regarding the heat generated by (or felt on) the amplifier's casing, the acceptable size for the unit, and the available power output.
Design ideas would also be welcome, and who knows—perhaps we will soon discover an amplifier that meets all these criteria
