You are comparing apples to oranges. The AP measurements of SMPTE IMD, as defined by AP, includes noise whereas the REW measurements you showed do not include noise. And AP's definition of SMPTE (DIN) appears to be different from TD+N in REW, too.The hump shows up in traditional CCIF IMD as well, as you can see in the graph I posted, given that your ADC has low enough noise.
And the Cirrus hump distortion does NOT occur in SMPTE IMD tests. The rise of SMPTE IMD in your graph is low enough and on par with recent ESS DACs'. This SMPTE IMD rise has a very different cause.
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