Hi gents,
I am building a set of speakers and desire to use digital crossovers, with direct amp connections to each driver, necessitating a 4+ channel DAC.
Failing to find a DAC that is available, with decent specs, and without needing to spend thousands, I researched and decided upon designing and building a PCB for the ES9081, as the datasheet seemed approachable (I have done a few PCBs before, albeit not for high-end audio).
I have an old MiniDSP USBStreamer lying around, so I wanted to interface the I2S outputs from the USBStreamer to the ES9081 DAC, and send control/config messages to it via an ESP32 via I2C.
I had mostly finished before I stumbled on @MCH's thread where he designed and build a PCB for the predecessor to this DAC, the ES9080.
He has designed his PCB in a very similar way to the one I have, but I have a few differences, in that I am attempting to electrically isolate the ESP23 and USBStreamer from the DAC, to minimise any kind of electrical noise those boards might introduce to the sensitive ES9081.
To facilitate that, I am isolating the USBStreamer via 2x ISO7740FDWRs and the ESP32 via a ISO1541DR.
I am isolating the USBStreamer and the ESP32 from each other as well, via keep-out zones on the PCB.
And since the USBStreamer does not provide it's own 3.3V via the J1/J2 pins, I am giving the 2x ISO7740FDWRs their own linear regulator so that it is also isolated to it's own ground plane area.
Lastly, the other main difference between our boards is that I am not putting RCA connectors on the board. As I am connecting this DAC inside my own amp chassis I am simply exposing a pad at the end of each channel output for me to solder the audio lines to connect to the amp inputs with.
Before sending to JLCPCB to fabricate it, I just wanted to ask if anyone is ok to have a look at my board design and tell me if they see anything very bad/fixable about it before I send it off to fab?
It will be a 4 layer board to minimise the distance between the top later and the first ground layer. I've tried to follow all other best practices that I know of, such as vias for every ground connection, uninterrupted ground plane (except in the exact areas that ESS recommend to put ground cuts into), and keeping the ground sense lines directly underneath the channel signal lines wherever possible.
But if anyone sees anything they think looks like a very bad idea, I would love to know before I send it off to be fabricated.
Thanks to anyone who can have a look at it for me.
(Red = first layer, yellow = first ground, pink = second ground, green = bottom layer)
I am building a set of speakers and desire to use digital crossovers, with direct amp connections to each driver, necessitating a 4+ channel DAC.
Failing to find a DAC that is available, with decent specs, and without needing to spend thousands, I researched and decided upon designing and building a PCB for the ES9081, as the datasheet seemed approachable (I have done a few PCBs before, albeit not for high-end audio).
I have an old MiniDSP USBStreamer lying around, so I wanted to interface the I2S outputs from the USBStreamer to the ES9081 DAC, and send control/config messages to it via an ESP32 via I2C.
I had mostly finished before I stumbled on @MCH's thread where he designed and build a PCB for the predecessor to this DAC, the ES9080.
He has designed his PCB in a very similar way to the one I have, but I have a few differences, in that I am attempting to electrically isolate the ESP23 and USBStreamer from the DAC, to minimise any kind of electrical noise those boards might introduce to the sensitive ES9081.
To facilitate that, I am isolating the USBStreamer via 2x ISO7740FDWRs and the ESP32 via a ISO1541DR.
I am isolating the USBStreamer and the ESP32 from each other as well, via keep-out zones on the PCB.
And since the USBStreamer does not provide it's own 3.3V via the J1/J2 pins, I am giving the 2x ISO7740FDWRs their own linear regulator so that it is also isolated to it's own ground plane area.
Lastly, the other main difference between our boards is that I am not putting RCA connectors on the board. As I am connecting this DAC inside my own amp chassis I am simply exposing a pad at the end of each channel output for me to solder the audio lines to connect to the amp inputs with.
Before sending to JLCPCB to fabricate it, I just wanted to ask if anyone is ok to have a look at my board design and tell me if they see anything very bad/fixable about it before I send it off to fab?
It will be a 4 layer board to minimise the distance between the top later and the first ground layer. I've tried to follow all other best practices that I know of, such as vias for every ground connection, uninterrupted ground plane (except in the exact areas that ESS recommend to put ground cuts into), and keeping the ground sense lines directly underneath the channel signal lines wherever possible.
But if anyone sees anything they think looks like a very bad idea, I would love to know before I send it off to be fabricated.
Thanks to anyone who can have a look at it for me.
(Red = first layer, yellow = first ground, pink = second ground, green = bottom layer)
Attachments
-
ESS ES9081 USBStreamer DAC Fourth Layer.png209.1 KB · Views: 145 -
ESS ES9081 USBStreamer DAC Second Layer.png192 KB · Views: 112 -
ESS ES9081 USBStreamer DAC Third Layer.png207.1 KB · Views: 111 -
ESS ES9081 USBStreamer DAC Top Layer Closeup.png398.6 KB · Views: 122 -
ESS ES9081 USBStreamer DAC Top Layer.png213.2 KB · Views: 113