Hi all,
Could you please help explain the high-level logic (for a beginner) in the following situation?
How do I determine whether it makes sense to replace a soldered OP275 when it is used as a low-pass filter (LPF) after an ES9018Q2 chip? For example, I am considering replacing (resoldering) the OP275 used in the LPF stage with an OPA1612. After this LPF stage, there is an OPA1622 used as the output amplifier (before the 3.5 mm headphones jack). For sound listening, I plan to use planar IEM headphones with 16 Ω impedance and 9x dB sensitivity.
Should the following factors be taken into account? If so, could you please clarify which ones matter most and which are less important:
- The surrounding components near the OP275 in the LPF stage (resistors and capacitors)
- Power supply lines (it is a Hi-Res Chinese player powered by a 3.7 V Li-Ion battery, followed by an MT3608 boost converter to ~13 V, and then an RT9193-3.3 LDO)
- Overall PCB quality (4-layer board)
- Measured noise floor at the 3.5 mm output using a 12-bit oscilloscope (for example it is bad, then there is no any sence to replace LPF=OP275)
Second question:
Is there any proven and simple measurement method to check whether there is an actual improvement after replacing the LPF=OP275 with an OPA1612?
If yes, what equipment would be needed? For example, is a 12-bit oscilloscope sufficient, or is THD+N measurement required instead? If THD+N is needed, what kind of equipment would be appropriate for measuring improvements in a LPF OU replacement scenario? For instance, would a minimal setup like an Intel-based PC with an integrated Realtek audio codec be sufficient?
PS: If it makes sense, I could also attach PCB photos, more detailed information, and, if needed, measurements from a 12-bit oscilloscope.
Many thanks in advance for your help.