Regardless of cooling there is no way on earth - as a project manager for a global blue chip electronics manufacturer - that I would have been able to get a QA signoff for product release with even 1/4 of the flex in the PCB as shown in @restorer-john 's example (EDIT: or @pma s). In fact I wouldn't have even tried - I'd have sent the design team back to fix it without asking for one.A couple of photos from my Hypex NC252MP (manufactured 49 week of 2020). So just more than a year younger than @restorer-john’s module. As mentioned earlier, there is some slight board flexure. Here is a view just after separating the heat plate…
View attachment 258721
As mentioned previously, it does appear that the thermal pad is pushing back on the output MOSFETs, but does not seem as bad as John’s module that overheated. Whether there is sufficient thermal conduction can be measured but I do not have proper equipment. Likely Hypex does though. In my QA tech days, it was a lot of intrusive thermal couple probes. Today, would use a good thermal imaging camera.
Here is a close-up of the circuit board in the area in question…
View attachment 258727
Overall, solder joints look good. Most likely done via wave soldering machine. The MOSFETs do look hand soldered, but this is not unusual in contemporary electronics manufacturing. They look like they are well done. I have been in plants all over the world and automation vs manual tradeoffs are commonly made depending on cost, time and quality concerns.
Just to be clear, am not an electronics designer and agree that board flexure does appear to be a design issue. However, this is just one more module in thousands that Hypex has sold. Not sure that the board bowing happens on NCore, SMPS or other MP series products despite sharing common integrated heat spreader design.
Hypex clearly designs their modules for mounting in real world speakers and so extra steps are taken to deal with shock and vibration. These are stresses beyond what most consumer electronics need to consider during operation. Interestingly, surviving shocks during shipping is part of design considerations that many lay folks take for granted. Any serious electronics vendor has a myriad of tradeoffs to consider. With this in mind, I think it is important to consider the overall design in comparison to others.![]()
See that big R277 - that is a thin ceramic component along the line of flex. It can't bend, the solder joints can't move. Flexing the PCB puts it under enormous stress and there is significant risk of it (or any of the other ceramic coponents - pretty much all those SM resistors and capacitors) cracking and hence failing. And many of them are in the output transistor control circuit - so if they go the power device is likely to go as well.
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