That is a possibility - heat is the enemy of electrolytic caps of all sizes.
But the truth is we don't know and can't tell. Take the Topping PA5 problems. That was explained as a thermal issue within the potted modules. It is not clear to me if that was just heat failure internal to components - or if it was physical damage to the circuit as a result of differential expansion (I've seen that with potting in the past). Either way - it was a design weakness that caused the problem.
@restorer-john (I think it was) also identified a design weakness with one of the earlier versions of hypex amp modules where a PCB was used to clamp a power device to a heatsink. The resulting flex of the PCB caused failures.
We simply don't know what (if any) design weaknesses are sitting latent in any particular design. This can be in any class of amp - or any other electronic device come to that. What we do know though is high heat and/or heat cycling is a great way to turn a latent design weakness into an actual product failure.