ZolaIII
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- Jul 28, 2019
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It's a mith that modern DC G-H amplifiers are all that efficient, they are less efficient than D and again efficiency is in both cases determined by conversion (AC/DC) efficiency. You won't get a 90+% switching power supply in commercial products (eventually if you pay more but for your mobile or PC not your power amplifier). At best you will get higher grade one with 85% efficiency but in reality it will be about 80(D)~75(G-H) for amplifier as whole.
Other problem is typology. Not because you all are concerned about repairabiliti. If the IC is good (and we have lots of old one's and even new one's that are far from cutting edge manufacturing process [to one or two orders of magnitude]) and keept in good conditions (operational and otherwise) it will work for a very long time (more than 40 years). However other component's will work shorter as always (power rail switches, condensers and cetera). SoM is a system on module (or small PCB with IC's and everything else to form one if you like) you can not repair it and as far as you can get a new one you are good. They are very easy tu use and connect. The problem is (when it comes to power amplifiers) in a post modern digital class popularly called Hybrid or H as well like with everything else post modern classification stops to exist and development is uncertain in the sense of closed black box designs (which based on success may or may not be lost bat we cannot any more track the progress on design scale at least). Prototyping is of course much more complicated (on FPGA) and everything needs to be done in this stage as you can't adjust or modulate it afterwards (you can but it's expensive to re rute new layout for a new revision and bring it to silicone). Small to moderate batches production is rather expensive even the older lithography is used regarding IC's. So we use last modern digital class G (for differentiation) which whose precisely defined and H as inheriting its design with who knows what they added. The biggest challenge for OEM is becoming software integration and securing proper operating (seamless operating through it) not to mention long term support regarding it as OEM's can only blow the whistle if vendor failed/didn't want or just all the sudden discontinued IC for what ever reason and that's what's producing the most of e-waste. But all of those are challenges of digital age and I am certain that will be overcome to the current extent (with open source and community work mostly).
Other problem is typology. Not because you all are concerned about repairabiliti. If the IC is good (and we have lots of old one's and even new one's that are far from cutting edge manufacturing process [to one or two orders of magnitude]) and keept in good conditions (operational and otherwise) it will work for a very long time (more than 40 years). However other component's will work shorter as always (power rail switches, condensers and cetera). SoM is a system on module (or small PCB with IC's and everything else to form one if you like) you can not repair it and as far as you can get a new one you are good. They are very easy tu use and connect. The problem is (when it comes to power amplifiers) in a post modern digital class popularly called Hybrid or H as well like with everything else post modern classification stops to exist and development is uncertain in the sense of closed black box designs (which based on success may or may not be lost bat we cannot any more track the progress on design scale at least). Prototyping is of course much more complicated (on FPGA) and everything needs to be done in this stage as you can't adjust or modulate it afterwards (you can but it's expensive to re rute new layout for a new revision and bring it to silicone). Small to moderate batches production is rather expensive even the older lithography is used regarding IC's. So we use last modern digital class G (for differentiation) which whose precisely defined and H as inheriting its design with who knows what they added. The biggest challenge for OEM is becoming software integration and securing proper operating (seamless operating through it) not to mention long term support regarding it as OEM's can only blow the whistle if vendor failed/didn't want or just all the sudden discontinued IC for what ever reason and that's what's producing the most of e-waste. But all of those are challenges of digital age and I am certain that will be overcome to the current extent (with open source and community work mostly).
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